Plates

Lewcott has been providing prepreg material to armor plate applications for the past three decades and has a wide product offering for your plate needs.

Data sheet available by clicking bold link

EP200HT

EP200 HT is an advanced epoxy prepreg system that is a low temperature curing, rubber modified epoxy that offers a wide variety of curing capabilities.

EP202

EP202 is a low temperature curing, rubber modified epoxy that offers a wide variety of curing options. EP202 prepreg has the ability to snap cure at 275°F in a 20 minute dwell as well as cure at 170°F in five hours. EP202 is flame resistant and displays a Tg of 300°F+ without requiring a post cure. EP202 can be used for a wide variety of structural applications.

EP254

EP254 is a low temperature curing, toughened epoxy that cures in the 235°F to 275°F range. EP254
co-laminates to graphite epoxy prepregs without shear failure between the dissimilar materials and is
available in a wide range of tack and drape. EP254 handling characteristics makes it especially well
suited for table rolling applications.

EP255

EP255 is a modified epoxy that is cured in the 235 to 275ºF temperature range. It is self-adhesive to
aramid and aluminum honeycomb. EP255 exhibits very good strength properties and can be used for a wide variety of structural applications. This modified epoxy prepreg is self-extinguishing, and passes the 60 Second Vertical Ignition Test listed in FAR 25.853.

EP255N

EP255N is a variant of the EP255 system with increased mechanical performance over EP255.
EP255N is a modified epoxy that is cured in the 235 to 275°F temperature range. It is self-adhesive to aramid and aluminum honeycomb. EP255N exhibits excellent strength properties and can be used for a wide variety of structural and aerospace applications. EP255N meets the requirements of MIL-R-9300B, type 1. EP255N has excellent resistance to ethylene glycol, hydrocarbon fluids and oils, Skydrol® and water.

EP255FA

EP255FA is a 250°F curing, modified epoxy film adhesive that is designed for use in a variety of
bonding applications such as metal to metal, metal to composite, composite to composite, composite
to core or metal to core. Sandwich constructions suitable for this adhesive include aramid, aluminum
and various foams. Cure temperatures as low as 235°F can be utilized, allowing the use of temperature sensitive skins and cores. Autoclave, oven or press molding operations are applicable.

LC799

LC799 is a modified, latent curing phenolic resin that displays an outstanding combination of toughness and adhesive properties. It is primarily used in ballistic armor applications requiring conformance to MILL- 52474 and MIL-H-44099. LC799 can be provided in pigmented form (olive drab, OG).

LC310

LC310 is a high performance polyester prepreg that is used in a wide variety of applications including: ballistic armor, structural components, recreational equipment and radomes. LC310 has an outstanding combination of strength and toughness.